Tấm wafer

Size (Inch) × conduction type: 4 × P type (low resistance)
OF length (mm) × wafer thickness (μm): 32.5 ± 2.5 x 525 ± 25
Quantity: 1 piece
Manufacturing method: CZ method
Face orientation: 100
OF position: 110
Resistance value: ≦ 0.02 Ωcm
particles: unquestioned particles
* Special orders:
The azimuth (Cut Angle), OF position angle tolerance, and thickness tolerance can be machined with smaller precision, enabling precise groove formation
Various shapes and surface treatments are possible (Example: Counterbore, Holemaking, and Oxide Wafer)
The specific resistivity and the wafer thickness are available.